Engineering publications brought to you by Mark Allen

Neil Tyler

Power

SemiQ 1200 V Gen3 SiC MOSFET modules reduce switching losses

Power

ROHM develops compact high heat dissipation SiC power modules

EDA & Design Software

Siemens collaborates with TSMC to drive innovation in semiconductor design and integration

ASIC & SoC

S2C and Andes Technology accelerate advanced RISC-V SoC development

Internet of Things

Crypto Quantique unveils QRoot Lite – a configurable root-of-trust IP for IoT devices

Distribution

Farnell adds NXP microcontrollers and FRDM development boards to portfolio

Communications

Putting the building blocks in place

Security

UltraPQ-Suite supports specialised implementations of post-quantum cryptography

Test & Measurement

Anritsu and MVG develop Wi-Fi 7 OTA measurement solution

Electronics

TSMC unveils details regarding its advanced A14 node

Sensors

Microchip introduces MCU family to simplify analogue sensor design

Manufacturing

EU invests €6 million in new networks to power factories of the future