Engineering publications brought to you by Mark Allen

Neil Tyler

Electromechanical

Thunder Series of integrated antenna enclosures from Taoglas

EDA & Design Software

US now seeks curbs on chip design software

Test & Measurement

Yokogawa releases SL2000 high-speed data acquisition unit

Space

Infineon launches new radiation hardened GaN transistors

Electronics

Nvidia once again beats Wall Street expectations

Embedded Systems

SEGGER partners with Allegro MicroSystems to support high-performance MCUs

Electronics

AMD acquires photonics startup Enosemi

Consumer

Could immersive content stretch wireless networks to breaking point?

ASIC & SoC

EnSilica establishes new engineering hub in Cambridge

Wireless Technology

NXP enables secure authentication with NTAG X DNA connected NFC tag

Power

Cissoid’s modular SIC inverter platform now available from Rhopoint Components

Electronics

TSMC to open its first European Design Centre in Munich in Q3 2025