Engineering publications brought to you by Mark Allen

Neil Tyler

EDA & Design Software

US now seeks curbs on chip design software

Test & Measurement

Yokogawa releases SL2000 high-speed data acquisition unit

Space

Infineon launches new radiation hardened GaN transistors

Electronics

Nvidia once again beats Wall Street expectations

Embedded Systems

SEGGER partners with Allegro MicroSystems to support high-performance MCUs

Electronics

AMD acquires photonics startup Enosemi

Consumer

Could immersive content stretch wireless networks to breaking point?

ASIC & SoC

EnSilica establishes new engineering hub in Cambridge

Wireless Technology

NXP enables secure authentication with NTAG X DNA connected NFC tag

Power

Cissoid’s modular SIC inverter platform now available from Rhopoint Components

Electronics

TSMC to open its first European Design Centre in Munich in Q3 2025

Electronics

SCI Semiconductor secures £2.5m towards developing CHERI-secured MCU