Engineering publications brought to you by Mark Allen

Arteris unveils Magillem Packaging for IP blocks and chiplets

Siemens introduces new solutions to support 2.5/3D IC designs

NVIDIA boosts investment in AI start-ups

Red Pitaya and Texas Instruments unveil next generation STEMlab boards

Challenging times

Nordic Semi looks to transform connected product development with Memfault acquisition

Bosch’s BHI385 sensor provides accurate acceleration measurement up to ±28 g

xMEMS delivers first in-frame active thermal management for AI-driven wearables

TDK expands the GENESYS programmable power supply series

STMicroelectronics' L9800 low-side driver now ISO 26262

IAR platform upscales embedded software development workflows for Renesas MCU architectures

Ceva launches MotionEngine Hex delivering 6-DOF motion tracking and intuitive control