Engineering publications brought to you by Mark Allen

Semiconductors

CEA-Leti and Soitec to leverage FD-SOI to provide enhanced security of integrated circuits

US restrictions drive Chinese chip industry consolidation

Applied Materials and CEA-Leti expand joint lab to drive development of specialty chips

NXP and Rimac co-develop centralised vehicle architectures for SDVs

Murata presents first resin-moulded thermistor with wire-bonding

Cyient Semiconductors and MIPS to develop custom RISC-V-based intelligent power solutions

Elliptic Labs and Ceva announce collaboration to enable smarter edge devices

Andes Technology unveils Deep Learning Accelerator for edge and endpoint AI

Plug and Play expands semiconductor ecosystem with Synopsys collaboration

Alphawave agrees to $2.4bn takeover by Qualcomm

GlobalFoundries looks to reshore essential chip manufacturing and accelerate AI growth

Samsung struggling with 3nm yields and remains far behind TSMC