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Consumer

Winbond launches HyperRAM WLCSP package

Bosch Sensortec teams up with Qualcomm

Low dropout regulator offers high PSRR for noise-sensitive applications

Cirrus Logic launches haptic and sensing technology solutions

Arm unveils a new suite of mobile IP

iPhone 11 becomes world’s most-popular smartphone model in Q1

Time-of-flight sensor enables multi-object ranging

Cadence delivers new verification IP

NXP RF front-end solutions used in Xiaomi smartphones

CUI unveils PSU range focused on small pumps and motors

Renesas introduces advanced signal conditioner IC

MediaTek launches Helio G85 mobile gaming-focused chipset