Engineering publications brought to you by Mark Allen

VSORA raises $46m to bring AI inference chip to market

XP Power presents a new series of high voltage DC-DC converters

Infineon introduces compact CoolSET System in Package (SiP)

Intel’s new manufacturing process attracts interest

CORNERSTONE advances its silicon photonics services with new E-beam lithography capability

Amphenol RF expands its SMA cable assembly portfolio

Industry-first 20kV stand-off relay sets new standard for high voltage switching

Imec to coordinate development of EU Chips Design Platform

EU likely to miss 2030 microchip target

Prismatic Supercapacitors - Maximum performance in minimal space!

Professional LED tapes from the ESPE ELC/ELS series - Made with COB and SMD technologies

Codasip looks to accelerate CHERI adoption