The portfolio includes eight industrial (e.g. PMEG6010EXD), as well as eight AEC-Q101 qualified (e.g. PMEG4010EXD-Q) products. This release supports the growing trend for manufacturers to replace devices in SMA/B/C type packaging with smaller footprint CFP-packaged devices, especially in automotive applications.
These diodes are suitable for use in, for example, DC-DC conversion, freewheeling, reverse polarity protection and OR-ing applications.
For maximum design flexibility, this portfolio extension offers reverse voltages VR(max) ranging from 20 V to 60 V and forward currents IF(average) of 1 A and 2 A. The exposed heatsink of the CFP2-HP enables the highest level of heat dissipation (Ptot) at a small package footprint. The CFP2-HP package dimensions are 2.65 mm x 1.3 mm x 0.68 mm (inc. leads).
Utilising the copper clip design, these packages meet the demands of efficient and space-saving designs. Today, CFP packaging is used by different power diode technologies such as Nexperia’s Schottky and Recovery Rectifier Diodes and will also be extended to bipolar transistors soon. It offers significant product diversity.
An optimised portfolio of planar Schottky diodes for automotive and industrial applications will be released in May.
