The four new devices include the ISL71001SLHM/SEHM point of load (POL) buck regulator, ISL71610SLHM and ISL71710SLHM digital isolators, and the ISL73033SLHM 100V GaN FET and integrated low-side driver.
Combining rad-hard assurance levels with the board area savings and cost advantages of plastic packaging, this new portfolio of devices looks to bring space-grade solutions to missions in medium/geosynchronous Earth orbit (MEO/GEO) with longer lifetime requirements, as well as small satellites (smallsats) and higher density electronics, while reducing size, weight, and power (SWaP) costs.
These ICs also complement the radiation-tolerant plastic-package ICs Renesas introduced in 2017 for smallsats in Low Earth Orbit. Together, this plastic IC lineup is able to support multiple orbit ranges, providing the radiation performance and optimal cost balance required for a variety of satellite subsystems and payloads.
To ensure the plastic ICs adhere to the highest quality for operation in harsh space environments, these devices feature QMLV-like production level testing, and all devices will undergo Radiation Lot Acceptance Testing (RLAT).
The production test flow includes 100 percent CSAM, X-Ray, Temperature Cycling, Static and Dynamic Burn In, and visual inspection, and aligns with the SAE AS6294/1 standard for plastic encapsulated microelectronics in space. Additional screening includes Lot Assurance Testing per assembly and wafer lot product for HAST, Life Testing, and Moisture Sensitivity.
The rad-hard ICs are characterization tested at a total ionizing dose (TID) of up to 75krad(Si) for low dose rate (LDR) and at a linear energy transfer (LET) of 60MeV•cm2/mg or LET 86MeV•cm2/mg for single event effects (SEE). The ISL71001SEHM is rated at TID up to 100krad(Si) for high dose rate (HDR).