CoolMOS P7 platform to come in a SOT-223 package

The recently launched CoolMO P7 platform from Infineon is expanding to include a SOT-223 package. The device has been developed as a one-to-one drop-in replacement for DPAK and is therefore fully compatible with a typical DPAK footprint.

According to the company, the combination of the CoolMOS P7 technology with the SOT-223 package is suitable for applications such as chargers for smartphones, laptop adapters, TV power supplies and lighting.

The CoolMOS P7 is said to address the needs of the low power switched mode power supply market and to offer ease-of-use, improved form factors and a price competitive Superjunction technology.

According to the company, the thermal behaviour of the CoolMOS P7 in this package was assessed across several applications. When the SOT-223 was placed on a DPAK footprint, the temperature increased by a maximum of 2 to 3°C compared to a standard DPAK. With a size of the copper area at 20mm² or more, the thermal performance was equal to DPAK.