Available in 500, 600, 650 and 700V offerings, the thermal behaviour of CoolMOS in the new package was assessed in several applications. When the SOT-223 was placed on a DPAK footprint, the temperature increased by a maximum of 2 to 3°C compared to DPAK. Furthermore, the SOT-223 package allows for space savings in designs that are optimised for power density, and where thermal requirements are less critical.
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CoolMOS CE package is cost-effective drop-in replacement for DPAK
Infineon Technologies is expanding it CoolMOS CE portfolio with a SOT-223 package. This package is claimed to offer a cost effective alternative to DPAK as well as space savings in some designs. The SOT-223 package without middle pin is said to be compatible with a typical DPAK footprint and can be used as a drop-in replacement for DPAK for designs in LED lighting and mobile charger applications.
