AEC-Q101 Trench 9 MOSFETs from Nexperia

Nexperia has launched a series of Trench 9 power MOSFETs, targeted primarily at the automotive industry, which combine the company’s low voltage superjunction technology with its advanced packaging capability to deliver high performance and ruggedness.

Nexperia is expanding its Power-SO8 MOSFETs portfolio to include ultra-low RDS(on) parts that address the demand for higher power density in many typical automotive applications. The new Trench 9 devices are all qualified to AEC-Q101, and exceed the requirements of this international automotive standard by as much as two times on key reliability tests including temperature cycling, high temperature gate bias, high temperature reverse bias and intermittent operating life.

LFPAK56E is an enhanced version of the popular LFPAK56 package, with an optimised lead frame and package design that results in an improvement in RDS(on)and power density of up to 30%. This improvement in power density enables the Trench 9 LFPAK56 MOSFETs to be used in applications previously only possible with D2PAK and D2PAK-7, delivering significant PCB space-savings.

Nexperia’s superjunction technology offers an improved avalanche and SOA (safe operating area) capability when compared to competing technology ensuring critical devices survive even in fault conditions. Trench 9 has been specifically designed to offer single shot and repetitive avalanche performance for demanding application and fault conditions.

Applications include brushed and brushless motor control for power steering, transmission control, ABS, ESC, pumps (water, oil and fuel), fan speed control, reverse battery protection and DC/DC converters.