Using Intel’s advanced hybrid architecture, with up to 16 performance-cores plus 8 efficient-cores and an increased cache of 36MB, the module offers much improved performance per watt along with AVX-512 VNNI and Intel UHD AI inferencing support for a diverse range of edge AI and IoT use cases.
Available with up to 13th Gen Intel Core i9 processor at 65W TDP, the COM-HPC-cRLS provides two 2.5GbE LANs and up to 128GB DDR5 SODIMM at 4000MT/s. Most importantly, it includes 1 x16 PCIe Gen5 lanes that can support the same computing and transmission performance with fewer lanes than its predecessors, and with a bandwidth of up to 32GT/s, in driving next-gen compute-intensive edge innovations.
The module also offers Intel TCC (Time-Coordinated Computing) and TSN (Time Sensitive Networking) support.
TCC brings precise time synchronisation and CPU/IO timeliness within a system, whereas TSN optimises time precision for synchronised networking between multiple systems making it well suited for real-time computing workloads required by applications such as industrial automation, semiconductor equipment testing, AI robots, autonomous driving, and aviation.
The ADLINK COM-HPC-cRLS not only simplifies developers’ application-specific carrier designs and reduces their time to market significantly with PCIe Gen5 but also caters to various future-proof edge AI use cases at all fronts.
COM-HPC-cRLS
- Up to 24 cores (16 P-cores + E-cores), 32 threads
- 16 PCIe Gen5 lanes, 8 PCIe Gen4 lanes
- Up to 128GB DDR5 SO-DIMM at 4000 MT/s
- 2x 2.5GbE LANs
- AI inferencing (AVX-512 VNNI, Intel UHD)
ADLINK is also working to provide I-Pi development kits based on the ADLINK COM-HPC-cRLS module for on-the-spot prototyping and referencing.
