Available in two form factors - COM Express (COM.0 R3.1) Type 6 Compact size and SMARC 2.1 Short size – they both offer up to 8-core CPUs at 6/9/12W TDP.
Both modules utilise Intel’s Gracemont architecture, with broadened cache and memory bandwidth, responsive coding footprint, combined with soldered-down memory and extreme temperature option, delivering improved performance with great efficiency for a wide-range of ruggedised IoT solutions at the edge.
The ADLINK cExpress-ASL module offers a 2/4/8-core Intel Atom x7000RE & x7000C series processor, boosting up to 3.8 GHz, up to 16GB LPDDR5 memory, and is integrated with Intel UHD graphics with up to 32 execution units. Along with support for two digital display interfaces (DisplayPort/HDMI), eight PCIe x1 Gen3 lanes, 2.5GbE LAN, and USB 3.2 it is suitable for industrial automation, industrial HMI, robotics and AI.
The ADLINK LEC-ASL SMARC module, on top of the 2/4/8-core Intel Atom x7000RE & x7000C series CPU with 4/8/16GB memory, adds support for two CAN bus, and two MIPI CSI for camera connectivity, suiting IoT applications requiring image capturing and on-device graphics processing, such as smart retail, measurement, access control, and transportation.
Both modules feature the Intel Atom x7000C series and are equipped with Intel TCC (Time-Coordinated Computing) and TSN (Time Sensitive Networking) support.
Intel TCC boasts precise time synchronisation and CPU/IO timeliness within a system, while TSN optimises time precision for synchronised networking between multiple systems.
Built for highly responsive on-device AI execution they can also withstand ruggedised use scenarios, allowing developers to realise various IoT edge innovations.
ADLINK will also be providing COM Express and SMARC development kits based on the cExpress-ASL and LEC-ASL modules, with carriers supporting all-around comprehensive interfaces for on-the-spot prototyping and referencing.
