Engineering publications brought to you by Mark Allen

Product Launches

Interconnection

New PCB connectors open up design freedom

Embedded Systems

QS93 SoM delivers miniaturisation, high thermal efficiency and low EMI

5G

One-piece 2nd generation GDBC connectors for complex stack ups in 5G systems

Power

Nexperia expands portfolio offering precise power control with extra system safety

Displays

7-Inch Touch Panel PC with 800:1 contrast ratio

Embedded Systems

ADLINK’s COM-HPC module offers i9, 24 cores, and 36MB cache at 65W TDP

RF & Microwave

Wi-Fi 6E components handle frequencies up to 12 GHz

Interconnection

Cinch Connectivity Solutions unveils mmWave Angled 30-degree product family

Power

Infineon adds to OptiMOS 5 portfolio targeting high power ECUs

Board Level Design

THERM-A-GAP GEL 50TBL, a dispensable thermal gel for thin bond line applications

RF & Microwave

New remote electrical tilt antennas

Power

MOTIX MCU embedded power IC-families with CAN FD interface