Toshiba Memory adds BiCS FLASH-Enabled UFS to embedded flash memory auto portfolio

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Toshiba Memory America, (TMA), the US subsidiary of Toshiba Memory, has begun sampling new automotive UFS JEDEC Version 2.1 embedded memory solutions.

The company’s automotive UFS supports a wide temperature range, from -40°C to +105°C, meets AEC-Q100 Grade2 requirements and offers the improve levels of reliability that are required by various automotive applications.

The line-up consists of four capacities: 32 gigabytes (GB), 64GB, 128GB, and 256GB[5].

The products are embedded flash memory devices that integrate BiCS FLASH 3D flash memory and a controller in a single package.

Connected and autonomous vehicles expected to generate enormous amounts of data, so the storage requirements for automotive applications are set to increase significantly. These BiCS FLASH-enabled UFS devices look to provide customers with an option that is better suited to support their high-performance and density needs than existing e-MMC and UFS devices.

The 256GB product’s sequential read and write performance, for example, has been improved by approximately 6 percent and 33 percent, respectively, over previous generation devices.

“Due to the significant performance improvements it brings, UFS has become the mainstream solution for high-end and mid-tier smartphones,” said Scott Beekman, director of managed flash memory products for Toshiba Memory America. “It’s only natural that automotive applications follow the same course.”

The new UFS devices feature several functions to meet the requirements of automotive applications including Refresh, Thermal Control and Extended Diagnosis.

The Refresh function can be used to refresh data stored in UFS and helps extend the data’s lifespan. The Thermal Control function protects the device from overheating in the high-temperature circumstances that can occur in automotive applications. Lastly, the Extended Diagnosis function helps users easily understand the device’s status.