Sondrel to list on London Stock Exchange's AIM market

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Sondrel, a designer and supplier of ASIC chip solutions, is planning to list on the London Stock Exchange’s AIM market.

Trading is expected to begin from the 21st of October 2022 with the ticker SND.

The Group is one of only a few non-Asian companies capable of designing and supplying the higher-spec chips built on the most advanced semiconductor technologies, selling into a range of hyper growth end markets such as high-performance computing, automotive, artificial intelligence, VR/AR, video analytics, image processing, mobile networking and data centres.

Commenting Graham Curren, Sondrel’s Founder and CEO, said, “This float will be the perfect way to celebrate Sondrel’s 20th birthday. Admission to AIM will enable us to expand our global operations with more engineers and sales staff to ensure that we maintain our high levels of customer satisfaction as we grow. The majority of business over the past 10 years is from existing customers which is a great validation of our customer care in delivering exactly what they want.”

Sondrel specialises in the design and delivery of state-of-the-art digital chips that are the brains in new technology products that range from from satellites to internet infrastructures and from electric vehicles to 8K video processing for some of the world’s top technology companies.

Some of the company’s previous designs have been included in many well-known products such as the Apple iPhone, Sony PlayStation, Meta’s Oculus Quest virtual reality headset, Samsung, Google and Sony smartphones, JVC prosumer camcorders, and Tesla and Mercedes-Benz cars.

“We are renowned for designing complex digital chips with billions of transistors on a single chip down to 5nm process technologies that few rivals can come close to matching,” said Curren. “This is because of our combination of highly experienced engineers and investment in R&D so that we are always innovating new ways to design chips that become ever more complex every year. For example, our innovative suite of Architecting the Future IP platforms provides starting reference designs for five types of advanced chips so that solutions can be created in a de-risked and timely manner.

“The trust that builds with customers during the design phase is such that they increasingly ask us to handle all the complex stages of turning a design into final chips. This process requires working capital so listing will provide us with the funds to take on many more projects for our full turnkey service of design to final chips.”