According to Sondrel, the on-chip-interconnect was selected due to its configurability and performance. The product enables the SFA 350A multi-channel automotive vehicle IP platform requirements.
FlexNoC supports the ability to design the NoC to match the performance of IP blocks to ensure that data flows at the right speed in, out and around the SoC and enables designers to quickly design and verify a chip that precisely meets the customer’s silicon specifications.
The SFA 350A is part of Sondrel’s Architecting the Future family of IP reference platforms that provide a fast track to a custom SoC. The design is focused on ADAS to support driverless and automotive vehicle applications to meet ISO 26262 requirements. It has four channels for sensors that can be either passive for optical camera inputs or active using LIDAR and RADAR.
The product design is a complex platform enabled for scalability and flexibility due to its framework architecture. This allows the processor units for the chip’s four channels to be selected according to the processing power required by the application without any changes to the rest of the chip. This modular approach makes the system versatile and scalable. Powerful solutions can be created by ganging identical SFA 350A quad-core chips together to form a cluster, according to Sondrel.
Commenting Edwin Loverseed, head of engineering at Sondrel, said, “The SoC interconnect provides a complete, comprehensive solution spanning architecture exploration to physical implementation and verification.”
“Sondrel has specialized in large complex SoCs that are always pushing the envelope in terms of complexity and advanced nodes,” added K. Charles Janac, president and CEO of Arteris IP. “FlexNoC will enable Sondrel designers to continue to pioneer the creation of high-performance compute solutions that will innovate the automotive industry.”