Engineering publications brought to you by Mark Allen

Communications Hardware

Finwave Semiconductor announces successful $8.2m funding round

xMEMS extends µCooling Technology to AI data centres

Microchip expands data centre connectivity, storage and compute portfolios

Nexperia introduces optimised flip-chip package technology for automotive ESD protection

Toshiba unveils 4-bit dual-supply bus transceivers to manage UART or SPI interfaces

Infineon and RT-Labs integrate key communication protocols into XMC7000 MCU family

Private 5G and the UK

Quectel launches 5G transparent antenna

Demanding Data

Ceva unveils communication DSPs for advanced 5G and 6G applications

Morse Micro Wi-Fi 4 and HaLow Certified router now available

AccelerComm unveils latest generation of 5G NR NTN physical layer solutions