Siemens is to acquire UK-based UltraSoC Technologies, a provider of instrumentation and analytics solutions for system-on-chips (SoCs).

Siemens plans to integrate UltraSoC’s technology into its Xccelerator portflio as part of Mentor’s Tessent portfolio product suite.

The acquisition of UltraSoC will, according to Siemens, allow the company to provide a unified data-driven infrastructure that can enhance product quality, safety and cybersecurity, and deliver a more comprehensive solution that will help semiconductor industry customers to overcome a range of problems such as manufacturing defects, software and hardware bugs, device early-failure and wear-out, functional safety, and malicious attacks.

“Siemens’ acquisition of UltraSoC means that for the first time our customers can access not just design-for-test, but a comprehensive ‘Design for Lifecycle Management’ solution for system-on-chips, including functional safety, security and optimisation,” explained Brady Benware, Tessent Vice President and General Manager, Siemens Digital Industries Software. “By utilising design augmentation to detect, mitigate and eliminate risks throughout the SoC lifecycle, customers can radically improve time-to-revenue, product quality & safety, and profitability.

"UltraSoC has a fast-growing business and impressive customer list and, as part of Siemens, can complement Tessent to create a truly unique offering in the market.”

UltraSoC specialises in embedding monitoring hardware into complex SoCs to enable “fab-to-field” analytics capabilities. Tessent is a specialist in SoC design-for-test (DFT) solutions, and has established strengths in the field of automotive functional safety via its Tessent Safety Ecosystem. As a result of this acquisition these two highly complementary offerings will be able to provide a complete package of solutions, encompassing semiconductor design and production, functional safety, cybersecurity, and functional optimization of products in the field.

“This acquisition accelerates UltraSoC’s vision at a much larger scale with the incredible team, assets, industry know-how and footprint of Siemens,” said Rupert Baines, CEO, UltraSoC. “This will allow UltraSoC to better serve our customers by accelerating R&D, leveraging a much larger pool of go-to-market resources, and an enormous global infrastructure. It has been clear since our initial meeting that UltraSoC and Siemens share a vision on how technology businesses can transform their operations end-to- end, from design conception to field deployment and we are excited to join the community.”

UltraSoC‘s products are widely used in the automotive, high-performance computing, storage and semiconductor industries. The company was recently selected as a participant in the DARPA AISS (Automatic Implementation of Secure Silicon) program; and is a member of the Secure-CAV consortium, a collaborative project that aims to improve the safety and security of connected and autonomous vehicles (CAVs).

Siemens’ acquisition of UltraSoC is due to close in the fourth quarter of Siemens’ fiscal year 2020. Terms of the transaction were not disclosed.