Ranovus has announced the availability of its protocol-agnostic Odin 100G optical I/O cores based on GF Fotonix, GlobalFoundries’ next generation, monolithic platform.

GF Fotonix platform is the first in the industry to combine differentiated 300mm photonics and RF-CMOS features on a silicon wafer at scale. The announcement was made at OFC 2022, the optical networking event.

Odin 100G optical I/O chiplets and IP cores can be integrated with processors, switches, and memory appliances to enable new data centre architectures for machine learning, artificial intelligence, metaverse, cloud, 5G communications, and defence and aerospace.

Data centres are increasingly demanding efficient and cost-effective high-capacity interconnect solutions to meet the exponential growth in data-driven applications like ML/AI and metaverse. Odin 100Gbps optical I/O scales from 8- to 32-cores in the same footprint by combining Ranovus’ 100Gbps per wavelength monolithic EPIC (Electro-Photonic Integrated Circuit) cores with its proprietary laser and advanced packaging technologies.

“We are delighted to share our multi-disciplinary silicon-photonics IP cores and chiplets, and advanced packaging solutions with our customers who are driving the adoption of novel data centre architectures based on integrating best-in-class chiplets and co-packaged optics”, said Hojjat Salemi, Chief Business Development Officer of Ranovus. “Our close collaboration with GlobalFoundries underlines our joint commitment to deliver a fully featured set of qualified IP cores and chiplets with OSAT-ready high-volume manufacturing flows and supporting ecosystem to enable the huge potential of monolithic silicon photonics.”

Ranovus has developed a highly flexible co-packaged optics architecture (Analog-Drive CPO 2.0) together with a Tier 1 ecosystem for high volume manufacturing of Odin chiplets.  The first customer co-packaged solution with 800Gbps Odin optical I/O is also being demonstrated at OFC 2022 with samples based on the GF Fotonix platform already shipping.