Omni Design announces collaboration with imec

1 min read

Omni Design Technologies, a provider of high-performance, low-power mixed-signal Intellectual Property (IP) solutions, is collaborating with imec to enable customers to bring their semiconductor products to market faster using Omni Design IP.

“Customers are focused on the challenges and opportunities in the 5G, automotive, AI and IoT markets and developing new products to win in these segments,” said Dr. Kush Gulati, president and CEO of Omni Design Technologies. “By collaborating with imec, we aim to provide customers with access to high performance, low power mixed-signal IP that integrates seamlessly into their SoC to accelerate their time to market.”

“imec offers turnkey services for ASIC development to reduce design barriers and improve first-time silicon success,” said Steve Beckers, vice president and general manager imec.IC-link. “The addition of Omni Design, with its advanced mixed-signal IP solutions, to imec’s design and IP partner program will enable customers who are developing differentiated, high value products in fast growing markets.”

Omni Design provides high performance, ultra-low power Analog-to-Digital Converter (ADC), Digital-to-Analog Converter (DAC) and Analog Front End (AFE) IP as well as compact and low power process, voltage and temperature (PVT) monitors in advanced process technologies.

imec, through its imec.IC-link division, is able to offer world-class supply chain solutions to customers enabling them to design and fabricate an ASIC. imec.IC-link has experience in providing flexible turnkey services for hundreds of tape-outs every year and has been able to demonstrate a successful track record in markets such as automotive, industrial, IoT and AI.