NXP enables advanced Wi-Fi 6 performance for Honor Magic V

1 min read

NXP Semiconductors has announced that its WLAN7207H 2.4 GHz front-end integrated circuit (FEIC) enables Wi-Fi 6 connectivity in Honor’s flagship Magic V smartphone.

The WLAN7207x single FEM family provides routing and printed circuit board (PCB) design flexibility that enables optimised RF performance in a smartphone.

At a time when smartphones have become more complex, architectures and PCB designs have become increasingly challenging especially as consumers do not want to compromise on Bluetooth and Wi-Fi 6 performance, which delivers a number of enhancements over previous generations, including reduced latency and increased network capacity and efficiency.

The WLAN7207x family is intended to offer designers more freedom in routing and placement on the PCB, enabling greater RF optimisation that is able to support higher Wi-Fi 6 and Bluetooth performance.

“As consumers continue to rely on their smartphones for an ever-increasing list of data-driven benefits, Wi-Fi 6 addresses the need to move a rapidly expanding amount of data across more devices,” said Doeco Terpstra, Vice President and General Manager Smart Antenna Solutions, NXP. “Our FEIC solutions enable the Wi-Fi 6 performance benefits that consumers want while offering the design flexibility that OEMs need.”

“As smartphones have become more feature-rich, form-factor has become a differentiating feature for consumers,” said George Zhao, CEO of Honor. “NXP’s FEM solution has enabled us to overcome the increasing complexity and challenges presented by our flagship phone designs, while still offering the longer transmission range and improved signal quality consumers associate with Wi-Fi 6.”