New JEDEC standard for cooling simulation

1 min read

Siemens Digital Industries Software has announced the establishment of JEP181 - a neutral file, XML-based standard from the JEDEC Solid State Technology Association, a standards body for the microelectronics industry.

JEP181 looks to simplify thermal model data sharing between suppliers and end-users in a single file format called ECXML (Electronics Cooling eXtensible Markup Language).

The new standard was created to address a significant challenge for electronics manufacturers: as increasingly powerful processors allow companies to pack more performance and functionality into their designs, the effective management of heat dissipation and other thermal factors has become essential to the successful design of their next-generation electronics products.

While advanced electronics cooling simulation technologies enable the creation of highly accurate thermal models of new product designs, the absence of a uniform format for the exchange of thermal simulation data throughout supply chains has created duplication of effort and the potential introduction of errors into the stream.

Proposed via the JEDEC JC15 committee, the JEDEC JEP181 standard simplifies thermal model data sharing and will help electronics manufacturers reduce the time required to simulate and validate their thermal models.

Commenting Ghislain Kaiser, senior director, Intel, said, “This standardised format will allow more interoperability between engineering teams, leading to substantial time and cost savings by removing design barriers previously common in thermal engineering.”

“As a leader in industrial software solutions, our contribution to the new JEP181 standard can help drive the digitalization of design data to reduce both time and errors for today’s innovative electronics products,” said Jean-Claude Ercolanelli senior VP of Simulation and Test Solutions, Siemens Digital Industries Software. “Enabling a seamless digitalized software flow can radically increase the efficiency and accuracy of thermal simulation and enhance the performance and reliability of digital twin prototypes and manufactured products.”