Microchip has announced a significant expansion of its Gallium Nitride (GaN) Radio Frequency (RF) power device portfolio.

The company said that it has added new MMICs and discrete transistors that cover frequencies up to 20 gigahertz (GHz). These devices combine high power-added efficiency (PAE) and high linearity to deliver improved levels of performance in applications ranging from 5G to electronic warfare, satellite communications, commercial and defence radar systems and test equipment.

The devices have been fabricated using GaN-on-silicon carbide technology that provides a combination of high-power density and yield, as well as high-voltage operation and longevity of more than 1 million hours at a 255C junction temperature.

They include GaN MMICs covering 2 to 18 GHz, 12 to 20 GHz, and 12 to 20 GHz with 3 dB Compression Point (P3dB) RF output power up to 20 W and efficiency up to 25%, as well as bare die and packaged GaN MMIC amplifiers for S- and X-band with up to 60% PAE, and discrete high electron mobility transistor (HEMT) devices covering DC to 14 GHz with P3dB RF output power up to 100W and maximum efficiency of 70%.

“Microchip continues to invest in our family of GaN RF products to support every application at all frequencies from microwave through millimeter wavelengths, and our product portfolio includes more than 50 devices, from low-power levels to 2.2 kW,” said Leon Gross, vice president of Microchip’s discrete products business unit. “Together the products span 2 to 20 GHz and are designed to meet the linearity and efficiency challenges posed by the higher-order modulation techniques employed in 5G and other wireless networks, as well as the unique needs of satellite communications and defence applications.”

Microchip’s portfolio of RF semiconductors in addition to GaN devices ranges from gallium arsenide (GaAs) RF amplifiers and modules to low-noise amplifiers, front-end modules (RFFEs), varactor, Schottky, and PIN diodes, RF switches and voltage variable attenuators.

The company also provides high-performance surface acoustic wave (SAW) sensors and microelectromechanical systems (MEMS) oscillators and highly integrated modules that combine microcontrollers (MCUs) with RF transceivers (Wi-Fi MCUs) that support major short-range wireless communications protocols from Bluetooth and Wi-Fi to LoRa.