Joint venture targets EUV infrastructure for high volume

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Materials company JSR has signed a joint venture agreement with imec under which a new company has been set up with the gola of enabling manufacturing and quality control of EUV lithography materials.

“EUV lithography is critical to the advanced nodes of the future and imec is focused on supporting the entire supply chain to prepare an EUV infrastructure for high volume manufacturing,” said An Steegen, pictured, an imec senior vice president. “This joint venture with JSR underscores imec’s dedication to support material suppliers, giving them access to the most advanced process flow and state-of-the-art equipment.”

According to the partners, their collaboration will allow them to leverage their strengths when delivering photoresist solutions for the manufacture of advanced devices.

“We understand the importance of EUV lithography for the future of advanced semiconductor manufacturing technologies,” said Bart Denturck, who will be president of the joint venture company, EUV RMQC. “[We] will provide two crucial roles for EUV lithography – superior, high-quality manufacturing capability and expertise and services for quality control with advanced tools. We believe this partnership will deliver great EUV lithography solutions to the industry.”

* Meanwhile, imec, Inpria and TEL have developed an integrated patterning process for next generation high resolution devices using a non chemically amplified metal containing photoresist and EUV lithography.
The approach is said to enable significant process simplification and cost reduction, compared to traditional organic EUV photoresists.