Infineon, Mitsubishi sign igbt module sourcing agreement
Infineon Technologies and Mitsubishi Electric have entered an agreement under which they will both supply advanced igbt module packages to the industrial motion control and drives markets.
Under the agreement, Mitsubishi will market its latest generation of power chips, with currents ranging from 15A to 150A and voltages of 600V and 1200V, in Infineon's Smart-1,-2 and -3 packages.
As the creator of the SmartPACK/PIM module concept, Infineon will continue to manufacture and supply a range of fully compatible products using its own chip technologies and module manufacturing.
