Mitsubishi and Infineon collaborate to serve industrial drive market
Infineon Technologies and Mitsubishi Electric have agreed a service agreement in which they will both serve the industrial motion controls and drives market worldwide as sources for the advanced IGBT module packages SmartPACKs and SmartPIMs.
This package concept, recently developed by Infineon Technologies, will be available with the latest generation of power chip technologies from the two companies.
Under the agreement, Mitsubishi Electric will market its latest generation power chips of various ratings in the Smart 1, 2 and 3 housings of Infineon. The latter company, the creator of the SmartPACK/PIM module concept, will continue to manufacture and supply the same range of products using its own chip technologies and module manufacturing.
