Presto Engineering, a European expert in application-specific integrated circuit (ASIC) design, engineering, and production services, has successfully collaborated with HaiLa in developing the first complete analogue and digital implementation of HaiLa’s passive backscatter technology adapted to Wi-Fi RF bands.
Supporting an SPI interface, the chip brings connectivity to a wide range of IoT devices, such as multi-channel temperature and humidity sensors. The partnership to develop the BSC2000 demonstrates the path to extreme-low power in IoT devices used in building, home and industrial automation; consumer electronics and wearables; smart transportation; agriculture; medical; and automotive markets.
“HaiLa is pleased to have collaborated with Presto Engineering on the silicon implementation of the BSC2000," said Derek Kuhn, President and CEO, HaiLa Technologies. “This is another step forward in our mission to enable sustainable scaling of IoT over existing wireless infrastructures, helping end-users meet their net-zero goals through a massive reduction in battery waste. Presto’s long experience in ultra-low power RFID and NFC allowed HaiLa to complement its team with expert resources embedded into the development process, delivering the completed BSC2000 ASIC as one team.”
According to Cedric Mayor, CEO, Presto Engineering, “This project has shown that pushing the limit of IoT power efficiency is not only possible but a game changer for mitigating the cost and waste of battery usage.”
HaiLa’s passive backscatter foundational technology is protocol-agnostic. As the most common wireless local area network (WLAN) technology in residential, enterprise and industrial environments globally, HaiLa has focused its first adaptation on Wi-Fi as a key infrastructure enabler for IoT deployments.
The BSC2000 is sampling now and HaiLa will be demonstrating its technology at CES from January 9-12.
