With the demand for highly cost-effective systems is growing, they require integrated circuits (ICs) that are able to achieve significant area savings while, at the same time, reducing bill-of-materials (BOM) and printed circuit board (PCB) footprint by integrating discrete components onto the same die.
GF’s 180UHV platform features a 3.3V LV CMOS baseline, with options for HV18, HV30 and 700V UHV, that are able to deliver significant area savings for both digital and analogue circuit blocks, compared to the traditional 5V bipolar CMOS DMOS (BCD) technologies.
As part of a modular platform based on the company’s 180nm process node, GF’s 180UHV process technology delivers a 10x increase in digital density compared to previous generations for integrated AC-DC conversion.
For AC-DC conversion, the platform integrates high voltage transistors with precision analogue and passive devices to control high input and output voltages of AC-DC SMPS circuits. The process is qualified up to 150°C to accommodate the high ambient temperatures of power supply and LED lighting products.
"GF continues to expand its UHV portfolio to provide competitive technology capabilities that will enable our customers to play a critical role in bringing a new generation of highly integrated devices to real-world environments,” said Dr. Bami Bastani, senior vice president of business units at GF. “Our 180UHV is an ideal technology for customers that are looking to develop the highest-performing solutions for a new generation of integrated digital, analogue and high voltage applications.”
As a part of the company's analogue and power platform, GF provides various types of HV, BCD, and UHV technologies, allowing customers to integrate power and high voltage transistors across a wide range of voltages, from 5V to 700V, to meet the needs of low and high power applications.