In partnership with the Singapore Economic Development Board and with co-investments from committed customers, GF’s $4bn investment will play an integral role in meeting the growing demand for the company’s manufacturing technologies and services.
With the global demand for semiconductor chips growing at an unprecedented rate, with worldwide semiconductor revenue projected to increase 2.1 times in the next eight years, GF has planned capacity expansions at all its manufacturing sites in the US, Germany and, starting with the construction of phase one of its 300mm fab expansion, Singapore. When complete, GF will add capacity for 450,000 wafers per year, bringing GF’s Singapore campus up to approximately 1.5 million (300mm) wafers per year.
The new fab will be the most advanced semi manufacturing facility in Singapore and will further enhance GF’s ability to provide its feature-rich RF, analogue power, non-volatile memory solutions.
GF is adding 250,000 square feet (23,000 square meters) of cleanroom space and new administrative offices. The new fab will create 1,000 new high-value jobs such as technicians, engineers and more. With construction already underway, the Fab is planned to ramp in 2023.
“GF is meeting the challenge of the global semiconductor shortage by accelerating our investments around the world. Working in close collaboration with our customers and the Government of Singapore is a recipe for success that we are pioneering here and looking forward to replicating in the US and Europe,” said GF CEO Tom Caulfield. “Our new facility in Singapore will support fast-growing end-markets in the automotive, 5G mobility and secure device segments with long-term customer agreements already in place.”