First 3MP resolution SoC for automotive cameras

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Omnivision, a developer of semiconductor solutions, has launched the OX03D, a 3 megapixel (MP) resolution system-on-chip (SoC) for automotive surround-view systems (SVS), rearview systems (RVS) and e-mirrors.

According to the company, the SoC provides a seamless path for automotive OEMs to upgrade from 1MP to 3MP while retaining high performance, low power and the smallest 2.1 µm pixel size in a 1/4-inch optical format.

The OX03D4C has a fully integrated image signal processor (ISP), is capable of 140 dB high dynamic range (HDR), and includes the next-generation tone-mapping algorithm along with what is said to be the leading LED flicker mitigation (LFM) performance in the industry.

“Customers are asking for higher performance solutions for viewing applications. The OX03D4C, which is first to market, delivers a lot in a small package,” said Andy Hanvey, director of automotive marketing at OMNIVISION. “Our OX03D SoC enables automotive OEM customers to transition from 1MP to 3MP and keep the same optical format and mechanics from their previous-generation solutions, speeding time-to-market for high-demand SVS cameras.”

The OX03D4C includes both the pixel array and ISP within a single package and it has been optimised to deliver performance over the complete automotive temperature range. It features 105 dB motion-free HDR with a total range of 140 dB, and provides HDR and LFM simultaneously. It includes the next-generation tone-mapping algorithm for high contrast images, supports a number of CFA patterns, and can output both YUV and RAW process streams at the same time.

The OX03D4C provides four on-screen display overlay layers for driver guidelines, as well as distortion correction to straighten any curved edges from lenses with a wide viewing angle. It also consumes less than 500 mW power, enabling the use of a plastic case for lighter weight and lower cost.

The a‑CSP package size allows smaller cameras that can fit in much tighter spaces. The image sensor is built on Omnivision’s PureCelPlus‑S stacked die technology, which separates the imaging sensor array from the image sensor processing pipeline. This configuration supports additional system functionality and improves sensor performance, while enabling a much smaller footprint when compared with non-stacked sensors.

The OX03D4C SoC complies with ASIL B advanced safety standards and samples are available now, with mass production in Q4 2022