The device will first be used in a recently launched flagship model and depending on the model, up to 24 of the chassis-control devices will be used per vehicle. According to EnSilica, 2.5 million ASIC devices will be shipped to the carmaker over the next 12 months, with an anticipated production life of seven years.
The complex mixed-signal ASIC uses a BCD process with high-voltage transistors and combines extensive monitoring and fault detection circuits (for example open and short pins, over and under voltage detection and frequency monitoring) with duplicate redundancy on key functions.
The part is qualified to AEC-Q100 grade 0 and EnSilica’s in-house functional safety team developed the ASIC to meet the requirement defined in ISO26262 to the most demanding Automotive Safety Integrity Level (ASIL-D).
Work on the ASIC began back in 2018 and was signed off for production earlier this year. Design was undertaken by EnSilica, in close collaboration with the independent semiconductor testing and qualification firm, RoodMicrotec.
Commenting Ian Lankshear, Chief Executive Officer of EnSilica, said, “Our design team were able to deliver the first silicon samples in less than 12 months, given the complexity of this mixed signal chip and the added overhead of complying to the ISO 26262 at ASIL-D, this was real achievement. Both RoodMicrotec and EnSilica’s teams worked well together to take this through AEC-Q100 qualification, test program development and then preparing it for automotive quality production sign-off.”