Ceva delivers greater connectivity with new multi-protocol wireless IP

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Ceva, a licensor of silicon and software IP, announced the launch of Ceva-Waves Links at Embedded World last week.

Credit: Ceva

A new family of multi-protocol wireless platform IPs, this integrated offering supports the latest wireless standards to address the demand for connectivity-rich chips targeting Smart Edge devices in the consumer IoT, Industrial, automotive, and personal computing markets.

These IPs include Wi-Fi, Bluetooth, Ultra-Wideband (UWB), and IEEE 802.15.4 (for Thread/Zigbee/Matter), and offer a range of qualified, easy-to-integrate, multi-protocol wireless communications subsystems, each featuring optimised co-existence schemes and adapted to various radios and configurations.

The Links family leverages Ceva-Waves portfolio of wireless connectivity IPs, formerly known as RivieraWaves. Ceva-Waves Links100, an integrated, low power, Wi-Fi 6 / Bluetooth 5.4 / 802.15.4 communications subsystem IP for IoT applications is the first IP available in this family and is currently being deployed by an OEM customer.

The demand for smaller, low-cost, high-performing devices with versatile connectivity is driving the need to consolidate multiple connectivity protocols into a single chip and, according to ABI Research, this can be seen with the move from module-level integration to on-die chip integration. ABI is forecasting that Wi-Fi plus Bluetooth combo chipset shipments will approach 1.6 billion chips annually by 2028.

“Increasingly, wireless connectivity chips are required to handle multiple standards to meet the evolving needs and diverse use cases of consumer and industrial devices. The Ceva-Waves Links family lowers the risk and investment required to integrate multi-protocol wireless connectivity into chip designs. Moreover with support for UWB, the Links family also offers micro-location and radar sensing features for advanced smart edge devices,” said Andrew Zignani, Senior Research Director, ABI Research.

“The Ceva-Waves Links wireless connectivity IPs build on our extensive portfolio,” said Tal Shalev, Vice President and General Manager of the Wireless IoT BU at CEVA. “With many customers designing chips employing multiple wireless standards, Links is a natural extension, leveraging our technology and expertise to dramatically reduce the technology barrier but yet delivering a tailored, optimal solution that provides the high-performance, low latency and low-power connectivity required.”

The first member of the Ceva-Waves Links family, the Links100, is an integrated, low power, Wi-Fi / Bluetooth / 15.4 communications subsystem IP for IoT applications. Key features include:

  • Wi-Fi 6 optimised for cost-sensitive IoT applications,
  • Bluetooth 5.4 Dual Mode, supporting advanced Bluetooth Audio with Auracast, and with a comprehensive suite of Bluetooth profiles
  • IEEE 802.15.4 (for Thread, ZigBee, Matter) for smart home applications
  • Optimised co-existence scheme for efficient concurrent communications
  • Pre-integrated with a low power multi-protocol radio at TSMC 22nm process

Upcoming Links platforms may include:

  • Advanced Wi-Fi 6/6E/7 with MLO, for a variety of use-cases, from power-efficient IoT to high-speed data streaming
  • Next generation Bluetooth for Channel Sounding and High Data Throughout
  • UWB, supporting FiRa 2.0, CCC Digital Key 3.0, and Radar, for innovative micro-location and sensing features
  • Optimised co-existence schemes for each specific configuration
  • Pre-integrated radio solutions, including partner and customer’s own technology, to address a wide range of configurations and foundry process nodes