6SigmaET launches latest software version, Release 16

2 min read

6SigmaET by Future Facilities has launched its latest software version, Release 16, introducing an array of new and improved features and functionality.

Among the new functions are: Enhanced View Photorealistic Models, faster Joule Heating, faster PCB Import, optimised 1D Flow Network, and 6SigmaCommander AI Automation.

While Release 15 of 6SigmaET emphasised the importance of powerful solving and accuracy to thermal engineers, Release 16 looks to build on these functionalities with the addition of streamlined PCB Imports, photorealistic models in reports, powerful simulations - faster model creation, faster grid generation, and faster solve times - accelerating complex model simulations, and improved automation of model builds, edits, solves, and results generation.

Release 16 utilises the NVIDIACUDA Toolkit and AmgXlibrary to accelerate the Joule Heating solver. This GPU-acceleration enables solutions times that are 325 times faster on a single NVIDIA A100 Tensor Core GPU compared to a CPU-based run, reducing the solve time for complex models from hours to seconds.

In addition, the radiative heat transfer calculations now use the Monte-Carlo method with GPU-accelerated ray tracing using the NVIDIA OptiX engine/API. OptiX and CUDA libraries help accelerate the performance of the ray-tracing algorithm, resulting in a speed-up of 140 times on an A100 GPU when compared to a CPU. This performance boost, achieved with NVIDIA GPUs, delivers faster turnaround times for advanced thermal simulations in electronics without having to sacrifice complexity or accuracy when making design related decisions.

Thermal engineers also have more control with significantly faster (25 times faster), streamlined PCB imports and the ability to decide the level of import detail for each PCB layer.

The 1D Flow Network has been optimised to deliver fast and accurate thermal flow analysis of electronic systems and servers. As a result, the junction temperature of components and the heat transfer between liquid-cooled elements can be predicted within a single network.

Additionally, a representation of IT equipment can now be modelled as a 1D Flow Network within 6SigmaET and then used in a 6SigmaRoom data centre simulation to provide more detailed information on server operating conditions.

Finally, the powerful automation functionality in Release 16 uses 6SigmaCommander to create or edit models, run the solver and extract results enabling optimisation and AI interaction.

Commenting Tom Gregory, Product Manager at 6SigmaET, said, “Thermal engineers operate in a market that is constantly in flux. With the speed at which electronics and their associated uses are evolving, thermal engineers need to be able to rely on software that can keep pace with the demands of their job and the electronics industry.

“We listened to our customers’ feedback, and I’m delighted with what our team has achieved with 6SigmaET Release 16. With high-quality modelling to powerful simulations, customisable and collaborative reporting, time and cost savings, and fast and accurate performance, 6SigmaET Release 16 empowers thermal engineers.”