Engineering publications brought to you by Mark Allen

New Electronics

NXP LPC1100XL

‘BLOB’ – Ground Breaking Plastic Enclosures from OKW

Synchronous buck converter offers 90% efficiency

ST tapes out 20nm test chip using Cadence design tools

Microsemi reacts to ProASIC3 fpga 'backdoor' claim

Xilinx ships ‘world’s first heterogeneous 3d fpga’

Deutsche Telekom launches M2M Marketplace

15W dc/dc converters offer 91% efficiency

Innovative biochip holds promise for cheap, portable HIV testing

Standardisation Group for Embedded Technologies inaugurated

Wireless road train premieres on Spanish motorway

Alloy set to replace gold in connector applications