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NXP and Rimac co-develop centralised vehicle architectures for SDVs

Murata presents first resin-moulded thermistor with wire-bonding

Cyient Semiconductors and MIPS to develop custom RISC-V-based intelligent power solutions

Singular Photonics and AMS Technologies to bring advanced SPAD sensors to Europe

Supermicro launches highly optimised AI solutions based on AMD Instinct MI350 Series

Tria’s latest family of modules now support Windows, Android and Linux

Quantum Networking Unit to scale quantum datacentres

Harwin extends Kona range of high-reliability SIL connectors

Quantum innovation programme drives advanced connectivity in the UK

New digital automotive audio amplifiers for smart-cockpit applications

NVIDIA building industrial AI cloud to support European manufacturing

Apple’s WWDC underwhelms