Engineering publications brought to you by Mark Allen

Manufacturing

ANSYS develops open file format for thermal simulations

NIST atomic clocks keep time well enough to improve models of Earth

Solution for next generation nanochips comes out of thin air

Battery-powered devices to benefit from a sense of hearing

Samsung's big semi capex spending keeps pressure on competition, says IC Insights

Meeting the connectivity expectations set by today's industrial applications

Molex introduces HarshIO Industrial Ethernet I/O modules

electronica 2018: Biggest electronica yet

electronica 2018: Smart, safe and secure

Study unlocks full potential of 'supermaterial' graphene

Ultra slim, low cost DIN rail power supplies

Intelligent framework aims to optimise data transfer in 5G networks