Engineering publications brought to you by Mark Allen

Semiconductors

NXP and Rimac co-develop centralised vehicle architectures for SDVs

Murata presents first resin-moulded thermistor with wire-bonding

Cyient Semiconductors and MIPS to develop custom RISC-V-based intelligent power solutions

Supermicro launches highly optimised AI solutions based on AMD Instinct MI350 Series

New digital automotive audio amplifiers for smart-cockpit applications

Imec presents 150 GSa/s DAC that can achieve 300 Gb/s data transmission

Elliptic Labs and Ceva announce collaboration to enable smarter edge devices

sureCore launches comprehensive suite of silicon services for next generation devices

Renesas brings USB-C Rev. 2.4 support to new RA2L2 MCU group

Andes Technology unveils Deep Learning Accelerator for edge and endpoint AI

Plug and Play expands semiconductor ecosystem with Synopsys collaboration

Alphawave agrees to $2.4bn takeover by Qualcomm