Engineering publications brought to you by Mark Allen

Research Design

AI set to reshape chip markets

Standard allows stacked dies in 3D ICs to connect with test equipment

New multicore processing modules for mission-critical aviation applications

Laser diode emits deep UV ligh

UK team takes the next step towards III-V Memory

Project looks to advance DNA-based archival data storage

Non-mechanical LiDAR sensors developed

Delivering innovation

Evonetix looks to scale up chip based technology production

Imec demonstrates scalable III-V and III-N devices on Si

All-optical technique creates frequency doubling in amorphous dielectric material

CES 2020 - NXP debuts i.MX applications processor with neural processing unit