Engineering publications brought to you by Mark Allen

Board Level Design

Smiths Interconnect expands Suzhou Qualification and Test site

Perforce Software looks to accelerate SoC development

Synopsys develops Silicon Lifecycle Management Platform

Micro:bit Educational Foundation partners with OKdo

Antenna integration

Trackwise looks to significant scaling up of flex PCB production

Rugged general purpose AB Series and BM Series enclosures from BCL

3-phase 5kW AC-DC power supply modules deliver compact design

AltiumLive 2020 goes virtual this October

Efabless expands support for Cloud-based design platform

Semiconductor verification solution embedded with ML capabilities

Avnet launches COM Express modules based on Tiger Lake UP3