Engineering publications brought to you by Mark Allen

Board Level Design

Cadence unveils next-generation Palladium Z2 and Protium X2 systems

Farnell expands range of SBCs and electronics tool kits from DFRobot

Thermal evolution

Machine learning capabilities added to DFM signoff for FinFET solutions

SnapEDA launches DipTrace support

Evaluation hardware for advanced EVE graphic controllers

First complete IP solution for PCI Express 6.0

Cadence unveils next-generation Sigrity X

UnitedSiC launches FET-Jet Calculator

‘Cooking up a connected product’

Air and conduction-cooled 3U CompactPCI processor

Plug and Play Cable Extension Kit for Raspberry Pi cameras