Engineering publications brought to you by Mark Allen

New Electronics

NEXT Semiconductor and BAE Systems to develop next generation space-qualified chips

Microchip expands data centre connectivity, storage and compute portfolios

FHE specialist Lattica emerges from stealth to tackle AI security challenges

Huawei to start testing Ascend 910D AI chips next month

M12 L- and T-coded connectors ensure reliability and durability

Cadence enables next-gen AI and HPC systems with ‘fastest’ IP memory system solution

Winners and losers

SemiQ 1200 V Gen3 SiC MOSFET modules reduce switching losses

ROHM develops compact high heat dissipation SiC power modules

Siemens collaborates with TSMC to drive innovation in semiconductor design and integration

S2C and Andes Technology accelerate advanced RISC-V SoC development

Crypto Quantique unveils QRoot Lite – a configurable root-of-trust IP for IoT devices