Engineering publications brought to you by Mark Allen

Semiconductors

Cadence unveils first silicon-proven, long-reach 7nm 112G SerDes IP

4G/5G summit: Qualcomm Quick Charge technology

Yokogawa launches next generation mixed signal oscilloscope

RS Components bolsters educational support with new tools to inspire young engineering talent

Qualcomm extends Wi-Fi experiences with 60GHz 802.11ay solutions

Socionext develops first HDMI 2.1 compatible video processing chips

Low-power 1.8V temperature sensor family

Faster, more flexible probe from STMicroelectronics

Renesas unveil RZ/A2M Microprocessor for high-speed processing

AVR microcontrollers now beta supported in MPLAB X IDE

Arm collaboration with Xilinx

Xilinx launches data centre and AI accelerator cards