Engineering publications brought to you by Mark Allen

Research Design

Bendable silicon wafer is just 15µm thick

Augmented reality could be a game changer in PCB design

Flat gallium joins roster of new 2-D materials

Low temperature approach creates new germanium-tin combinations

Super ‘superlattices’ could enable ‘superfast’ transistors

When rotated at a ‘magic angle’, graphene sheets can form an insulator or a superconductor

Modified, 3D-printable alloy shows promise for flexible electronics

International Conference and Exhibition on Device Packaging – Arizona

Leti and Mapper announce breakthrough in cyber-security

Cadence, imec tape out 64bit MCU test chip at 3nm

Smart contact lens for diabetics

European MiniZed SpeedWay Design Workshop series