The organisers state that the event is a ‘major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields’. IMAPS hope the conference will attract a diverse group within the industry and academia.
The three topical workshop tracks that will feature include:
- Interposers and 3D IC and packaging
- Flip chip, wafer level packaging and fan-out
- Engineered micro systems/devices (including MEMS, sensors and 3D printing)
There will be an array of half-day courses available on March 6, preceding the technical conference.
| Conference and technical workshops | Exhibition and technology showcase | Professional development courses | GBC plenary session |
