Engineering publications brought to you by Mark Allen

New Electronics

Creonic unveils CCSDS 131.2 Wideband Modulator IP Core achieving 1 GSymb/s

Archer further enhances biochip gFET design for advanced sensing

YorChip launches first dual-use PHY for chiplets

Analog Devices invests $1bn expanding Oregon semiconductor facility

onsemi and Magna sign long-term SiC supply agreement

High-power Harwin connector series benefits from 360° EMC backshells

Rugged IP67 & IP68 USB-C connectors from Live Electronics

A new AI industry body

Micron delivers fast, high- capacity HBM advancing generative AI innovation

NeoLogic raises $8 million in latest seed round

Mouser stocking u-blox’s ZED-F9P-GNSS module for AVs and robotics

Leaf Space receives funding as it strives towards seamless satellite connectivity