Engineering publications brought to you by Mark Allen

Semiconductors

Renesas is part of 1st wave of testing for Wi-SUN FAN 1.0 certification

Toshiba adds new 4-channel linear power amplifier for car audio

GF introduces Avera Semi to deliver ASIC solutions

Highly efficient isolated RS-485 module for Industry 4.0

Industry’s first visually lossless image compression for GPUs

Toshiba announces Bluetooth 5 IC for automotive applications

Connected-car automotive MCU from ST

Bringing AI to the edge

Cypress expands collaboration with Arm to deliver IoT platform with secure device management

Cadence unveils first silicon-proven, long-reach 7nm 112G SerDes IP

4G/5G summit: Qualcomm Quick Charge technology

Yokogawa launches next generation mixed signal oscilloscope