Engineering publications brought to you by Mark Allen

Semiconductors

Hexagon launches a new humanoid robot built for industry

US restrictions drive Chinese chip industry consolidation

Nordic Semiconductor announces acquisition of Neuton.AI

Applied Materials and CEA-Leti expand joint lab to drive development of specialty chips

Infineon integrates CAPSENSE into PSOC HV microcontrollers for smart sensors and actuators

NXP and Rimac co-develop centralised vehicle architectures for SDVs

Murata presents first resin-moulded thermistor with wire-bonding

Cyient Semiconductors and MIPS to develop custom RISC-V-based intelligent power solutions

Supermicro launches highly optimised AI solutions based on AMD Instinct MI350 Series

New digital automotive audio amplifiers for smart-cockpit applications

Imec presents 150 GSa/s DAC that can achieve 300 Gb/s data transmission

Elliptic Labs and Ceva announce collaboration to enable smarter edge devices