Engineering publications brought to you by Mark Allen

ASIC & SoC

Meeting the AI/ML design challenge

CEVA unveils NeuPro-M heterogeneous processor architecture

First 3MP resolution SoC for automotive cameras

Ambarella launches AI domain controller SoC family

Infineon introduces AIROC CYW20829 Bluetooth LE system on chip

ASPEED and CEVA collaborate to improve voice on Cupola360 SoCs

First silicon demonstration wafers with integrated embedded ReRAM module

UNISOC uses Imagination's NNA IP in SoC 5G platform

Ambarella and Autobrains collaborate on scalable range of AI solutions

Chilling effects

Energy harvesting solutions for tablet keyboards

Arasan announces availability of ultra-low power MIPI D-PHY IP