Engineering publications brought to you by Mark Allen

Electronics

SCI Semiconductor secures £2.5m towards developing CHERI-secured MCU

TI working with NVIDIA to bring efficient power distribution to AI infrastructure

Are reconfigurable AI ICs the future?

300mm RF silicon interposer platform paves the way for advanced RF and mixed-signal applications

Reports suggest Asahi Kasei plans to cut PIMEL shipments

EU consortium for edge-AI technologies opens services to external customers

Smart living made simple

International research team develop 5G satellite technology to advance global mobile connectivity

Global semiconductor CapEx rises 27% in Q1, according to SEMI

GlobalFoundries partners with A*STAR to accelerate advanced packaging innovation

Siemens makes AI-driven PCB design accessible for SMB electronics teams

Imec joins with MIT labs to explore groundbreaking diagnostic devices